Premium
Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character
Author(s) -
Tian Jianjun,
Wan Liqiang,
Huang Jianzhi,
Hu Yanhong,
Huang Farong,
Du Lei
Publication year - 2007
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.917
Subject(s) - curing (chemistry) , materials science , activation energy , glass transition , thermal decomposition , flexural strength , composite material , molar ratio , kinetics , alkyne , polymer chemistry , catalysis , organic chemistry , chemistry , polymer , physics , quantum mechanics
A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature T g and thermal decomposition temperature T d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol −1 . The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom