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Thermal stability and degradation kinetics of poly(methyl methacrylate)/layered copper hydroxy methacrylate composites
Author(s) -
Kandare Everson,
Deng Hongmei,
Wang Dongyan,
Hossenlopp Jeanne M.
Publication year - 2006
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.681
Subject(s) - thermogravimetric analysis , materials science , methyl methacrylate , polymerization , thermal stability , poly(methyl methacrylate) , composite number , composite material , differential scanning calorimetry , thermal decomposition , methacrylate , polymer chemistry , chemical engineering , polymer , organic chemistry , chemistry , thermodynamics , physics , engineering
Poly(methyl methacrylate) (PMMA)/copper hydroxy methacrylate (CHM) composites were prepared via solution blending and bulk polymerization. Addition of 3% by weight of the CHM additive using solution blending resulted in a significant increment (∼45°C) in thermogravimetric analysis (TGA) T 50 , the temperature at which 50% of the original polymeric mass is lost. The value T 50 increased by 30°C for a PMMA composite with 4% CHM, synthesized via bulk polymerization. Activation energies, E a , were calculated as a function of conversion fractions (TGA decomposition profile) for the polymeric materials. Analysis of multiple heating rate data using the Flynn–Wall–Ozawa method resulted in E a values that were 50 kJ mol −1 higher for conversions above 0.5 in the solution blended composite compared to a reference sample of pure PMMA recrystallized from the same solvent. Similar results were obtained for bulk polymerization process with differences in E a values > 30 kJ mol −1 relative to pure PMMA. However, in contrast to previous studies of bulk polymerized samples, the solution‐blended composite exhibited no improvement in cone calorimetry determination of total heat release as compared with the reference PMMA sample. Copyright © 2006 John Wiley & Sons, Ltd.