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Epoxy resins with high heat resistance and flame retardancy via a new process
Author(s) -
Kimura Hajime,
Ohtsuka Keiko,
Yonekawa Morio
Publication year - 2021
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.5100
Subject(s) - epoxy , materials science , imide , polymer chemistry , acid anhydride , curing (chemistry) , fire retardant , polymerization , heat resistance , composite material , organic chemistry , polymer , chemistry
To develop highly heat‐resistant and flame‐retardant epoxy resins, the curing behavior of an epoxy resin and the properties of the resulting cured product were investigated using two compounds as curing agents, an acid anhydride containing a phenylethynylcarbonyl group and an imide compound with a phenylethynylcarbonyl group at both ends. The results indicated that reaction between the acid anhydride group and the epoxy group first proceeded at about 150°C to 170°C, followed by reaction between the phenylethynylcarbonyl groups at about 250°C to 300°C. The reaction between the acid anhydride and the epoxy group proceeded more efficiently in the presence of a small amount of the imide compound. The resulting product exhibited very good heat resistance and flame retardancy. The crosslink density was increased by polymerization of the phenylethynylcarbonyl group, and the resulting polyene structure and intramolecular imide skeleton strengthened intermolecular interactions, likely due to the limited freedom of movement of the molecular chains.