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Synthesis and characterization of waterborne polyurethane/polyhedral oligomeric silsesquioxane composites with low dielectric constants
Author(s) -
Zhao Hui,
Zhao SiQi,
Hu GuoHua,
Zhang QunChao,
Liu Yang,
Huang ChongXing,
Li Wei,
Jiang Tao,
Wang ShuangFei
Publication year - 2019
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.4659
Subject(s) - silsesquioxane , materials science , polyurethane , hexamethylene diisocyanate , dielectric , trimer , thermal stability , polymer chemistry , composite material , chemical engineering , organic chemistry , polymer , chemistry , engineering , dimer , optoelectronics
A facile method was developed to synthesize a new type of polyhedral oligomeric silsesquioxane (POSS). It contained a single amine group and seven aliphatic moieties on its corners. FT‐IR, 1 H‐NMR, 13 C‐NMR, 13 C‐ 1 H COSY, and 1 H‐ 1 H COSY confirmed that cages with eight corners were the main part of the product. This new POSS was used to modify the structure of hexamethylene diisocyanate trimer and then copolymerized with hexamethylene diisocyanate and poly (tetramethylene glycol) to get a serious of waterborne polyurethane (WPU)/POSS hybrid materials with low dielectric constants for microelectronics applications. The results showed that POSS particles were uniformly dispersed in the WPU dispersions. The WPU/POSS films did not show any macrophase separation, even when the POSS content was as high as 16%. As the POSS content increased from 0% to 16%, the tensile strength was increased from 2.3 to 7.3 MPa, the dielectric constant was decreased from about 2.9 to 2.0, and the thermal stability of the WPU/POSS was also improved.