Premium
Exploitation of a promising flame‐retardant engineering plastics by molten composited polyketone and diethyl zinc phosphinate
Author(s) -
Guo Shuo,
Pu Shuiqin,
Zhao Jing,
Wang Ke,
Fu Qiang
Publication year - 2019
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.4630
Subject(s) - phosphinate , materials science , fire retardant , zinc , thermogravimetric analysis , fourier transform infrared spectroscopy , chemical engineering , polymer , composite material , polymer chemistry , metallurgy , engineering
Aliphatic polyketone (POK) is a new engineering plastic owning outstanding mechanics, chemical resistance, and gas/liquid barrier properties. However, analogous to other polymers, the nature of combustion severely restricts the widespread application of POK. Herein, the diethyl zinc phosphinate (ZnPi) was compounded with three grades of POKs, which were different among each other in viscosity as low ( L ), medium ( M ), and high ( H ) levels, by melt mixing. It is intriguing to suggest that increasing the viscosity of POK could remarkably improve the dispersion homogeneity of ZnPi, which was beneficial to superior flame retardancy, simultaneously with comprehensive mechanical properties. For the H ‐POK matrix, only 10% well‐dispersed ZnPi resulted in a V0 ranking with a good maintenance of its notched impact strength, whereas the load of ZnPi for reaching V0 rank increased to 14% in L ‐POKs and M ‐POKs and the mechanical performances decreased mildly. By a combination of scanning electron microscopy (SEM), Fourier‐transform infrared (FTIR), thermogravimetric analysis (TGA), and cone calorimetry, it is well revealed that the flame retardancy induced by adding ZnPi could mainly ascribe to the formation of various zinc phosphate species. This work exploits a facile and feasible method for fabrication of antiflame engineering plastics, which will be promising for large‐scale applicability of high‐performance POK materials.