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Poly(ether ether ketone)‐bischromenes: Synthesis, characterization, and influence on thermal, mechanical, and thermo mechanical properties of epoxy resin
Author(s) -
Karthikeyan Leena,
Mathew Dona,
Robert Temina Mary
Publication year - 2019
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.4539
Subject(s) - peek , materials science , epoxy , ultimate tensile strength , composite material , thermal stability , ether , fourier transform infrared spectroscopy , fracture toughness , polyether ether ketone , toughness , glass transition , polymer , polymer chemistry , chemical engineering , organic chemistry , chemistry , engineering
Poly(ether ether ketone) s with terminal propargyl groups (PEEK‐PR) were synthesized from hydroxyl terminated PEEK (PEEKTOH) and characterized. The heat‐triggered polymerization of PEEK‐PR to poly bischromenes having PEEK backbone was confirmed by Fourier transform infrared spectroscopy and differential scanning calorimetric studies. PEEK‐PR was blended with a bisphenol based epoxy resin‐diamino diphenylsulphone system in different proportions and cured to form PEEK‐bischromene‐interpenetrated‐epoxy‐amine networks. Tensile strength and elongation of the cured blends increased up to 10‐phr loading of PEEK‐PR and then declined. Tensile moduli of all formulations were comparable. Fracture toughness increased by a maximum of 33%, and the fractured surface morphology showed a ductile fracture. The blends exhibited slightly lower glass transition temperature to that of the neat epoxy‐amine system. A reference sample of epoxy‐amine was processed with the optimum loading of the precursor polymer, PEEKTOH, and compared its properties with the PEEK‐PR incorporated epoxy systems. In this way, it is found that the incorporation of addition curable propargylated PEEK increases the strength characteristics with adequate thermal stability and fracture toughness for high‐performance structural applications.