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Polyimides reinforced with the sol‐gel derived organosilicon nanophase as low dielectric permittivity materials
Author(s) -
Kramarenko Viktor Yu.,
Shantalil Tetyana A.,
Karpova Iryna L.,
Dragan Kateryna S.,
Privalko Eleonora G.,
Privalko Valery P.,
Fragiadakis Daniel,
Pissis Polycarpos
Publication year - 2004
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.422
Subject(s) - materials science , organosilicon , dielectric , permittivity , nanocomposite , percolation (cognitive psychology) , composite material , polyimide , relaxation (psychology) , sol gel , percolation threshold , glass transition , chemical engineering , chemical physics , polymer chemistry , polymer , electrical resistivity and conductivity , layer (electronics) , nanotechnology , optoelectronics , chemistry , psychology , social psychology , engineering , neuroscience , electrical engineering , biology
Polyimide (PI) nanocomposites prepared by the in situ generation of crosslinked organosilicon nanophase (ON) through the sol‐gel process were characterized by densities, thermally stimulated depolarization currents and dielectric relaxation spectroscopy. Both a looser molecular packing of PI chain fragments adjacent to the ON and a loose inner structure of the spatial aggregates of ON were assumed to be responsible for a non‐additive decrease of the experimental values of dielectric permittivity for the nanocomposites. The pattern of composition dependence of the apparent dielectric permittivity of the ON suggested a probability of a morphological change around the composition PAAS/MTS = 100/16 (presumably, a sort of percolation transition from small‐size, individual clusters into large‐size, infinite clusters). Thus, PI reinforced with the sol‐gel derived nanophase may have a reasonably good potential as low dielectric permittivity materials. Copyright © 2004 John Wiley & Sons, Ltd.