Premium
Surface modification of boron nitride via poly (dopamine) coating and preparation of acrylonitrile‐butadiene‐styrene copolymer/boron nitride composites with enhanced thermal conductivity
Author(s) -
Li Guohua,
Xing Rongfen,
Geng Peipei,
Liu Zhenxin,
He Lianqi,
Wang gyue,
Zhang Qingxin,
Qu Xiongwei
Publication year - 2018
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.4119
Subject(s) - materials science , boron nitride , composite material , acrylonitrile butadiene styrene , copolymer , polymerization , coating , surface modification , boron , chemical engineering , polymer , organic chemistry , chemistry , engineering
A biology‐inspired approach was utilized to functionalize hexagonal boron nitride (h‐BN), to enhance the interfacial interactions in acrylonitrile‐butadiene‐styrene copolymer/boron nitride (ABS/BN) composites. The poly (dopamine), poly (DOPA) layer, was formed on the surface of BN platelets via spontaneously oxidative self‐polymerization of DOPA in aqueous solution. The modified BN (named as mBN) coated with poly (DOPA) was mixed with ABS resin by melting. The strong interfacial interactions via π‐π stacking plus Van der Waals, both derived from by poly (DOPA), significantly promoted not only the homogeneous dispersion of h‐BN in the matrix, but also the effective interfacial stress transfer, leading to improve the impact strength of ABS/mBN even at slight mBN loadings. A high thermal conductivity of 0.501 W/(m·K) was obtained at 20 wt% mBN content, reaching 2.63 times of the value for pure ABS (0.176 W/(m·K)). Meanwhile, the ABS/mBN composites also exhibited an excellent electrical insulation property, which can be expected to be applied in the fields of thermal management and electrical enclosure.