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Synthesis of poly(silmethylene)s via ring‐opening polymerization of benzocyclobutene functionalized disilacyclobutene and their low‐dielectric and thermal properties
Author(s) -
Huang Yawen,
Zhang Shengbo,
Hu Huan,
Wei Xiaonan,
Yu Hongtao,
Yang Junxiao
Publication year - 2017
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.4025
Subject(s) - benzocyclobutene , materials science , dielectric , thermal stability , copolymer , polymerization , thermosetting polymer , polymer chemistry , ring (chemistry) , dielectric loss , chemical engineering , composite material , polymer , organic chemistry , optoelectronics , chemistry , engineering
In this work, benzocyclobutene‐introduced poly(silmethylene)s were synthesized by ring‐opening copolymerization of benzocyclobutene (BCB) functionalized disilacyclobutene with phenyldisilacyclobutene. The incorporation ratio of BCB was tailored by changing feeding ratio of 1,3‐dimethyl‐1,3‐dibenzocyclobutene‐1,3‐disilacyclobutane and 1,3‐dimethyl‐1,3‐diphenyl‐1,3‐disilacyclobutane, thus enabling the control of ultimate properties of cured resins. With increasing the incorporation ratios of BCB from 9.5 to 28.9 mol%, T5% of cured resins is improved from 404°C to 462°C, while the dielectric constant is decreased from 2.59 to 2.41 at 10 MHz. The excellent thermal stability and low‐dielectric performance make such thermosets potential inter‐layered or inter‐lined low‐dielectric media. Copyright © 2017 John Wiley & Sons, Ltd.