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Self‐adhesive epoxy modified silicone materials for light emitting diode encapsulation
Author(s) -
Liu Yishan,
Luan Xinying,
Feng Yakai,
Tan Xiaohua,
Han Ying,
Sun Xujun
Publication year - 2017
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.4024
Subject(s) - materials science , epoxy , adhesive , thermal stability , silicone , refractive index , fourier transform infrared spectroscopy , composite material , adhesion , polymer chemistry , chemical engineering , optoelectronics , layer (electronics) , engineering
In this paper, we prepared the light emitting diode (LED) encapsulant with self‐adhesion and high refractive index. In order to improve adhesion properties, we synthesized a series of multifunctional polysiloxanes with different contents of epoxy groups via the sol–gel condensation of methylvinyldimethoxysilane, diphenylsilanediol and 3‐glycidoxypropyldimethoxymethylsilane. The structures of epoxyphenylvinyl silicone (EPVS) resins were confirmed by proton nuclear magnetic resonance and Fourier‐transform infrared. The effect of epoxy group content on the adhesion property of EPVS resins was fully studied. The performances of the LED encapsulation materials based on EPVS resins were investigated in detail. These self‐adhesive encapsulating materials showed excellent thermal stability, a high refractive index of 1.55 and good adhesive property. These EPVSs can be used as an adhesion promoter for LED encapsulation materials. Copyright © 2017 John Wiley & Sons, Ltd.