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Development of novel cardo‐containing phenylethynyl‐terminated polyimide with high thermal properties
Author(s) -
Yu Ping,
Wang Yan,
Yu Junrong,
Zhu Jing,
Hu Zuming
Publication year - 2017
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.3878
Subject(s) - differential scanning calorimetry , materials science , rheometry , thermogravimetric analysis , imide , char , polyimide , glass transition , polymer chemistry , curing (chemistry) , chemical engineering , thermogravimetry , composite material , isothermal process , dynamic mechanical analysis , thermosetting polymer , polymer , pyrolysis , thermodynamics , physics , layer (electronics) , engineering
A phenylethynyl‐terminated reactive diluent [Card‐4‐phenylethynylphthalic anhydride (PEPA)], which contained fluorenyl cardo structures, was successfully synthesized and used as a modifier for flexible phenylethynyl‐terminated imide oligomer (PEI‐PEPA). The chemical structure, crosslink characterization, molecular weights, and thermal properties of the products were characterized. The imide systems with addition of 10, 20, 30, and 40 wt% Card‐PEPA to PEI‐PEPA (PEI‐PEPA‐Card) and their cured resin systems were prepared. The thermal curing behaviors of imide systems at different heating rates were analyzed by using differential scanning calorimetry. Thermal properties such as glass transition temperature ( T g ) and char yield at 800°C of the resultant resin systems were studied by differential scanning calorimetry, dynamic mechanical analysis, and thermogravimetric analysis. The rheological properties were also investigated using a dynamic rheometry. These properties were found to be outstanding compared with pure PEI‐PEPA. The uncured imide systems exhibited lower T g and lower isothermal viscosity with addition of Card‐PEPA. Furthermore, the T g and char yield of the cured resin systems increased with addition of Card‐PEPA. The cured resin systems containing 40 wt% Card‐PEPA exhibited the highest T g of 359°C and char yield at 800°C of 66.5%. Copyright © 2016 John Wiley & Sons, Ltd.