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Flame retardancy and heat resistance of phenol‐biphenylene‐type epoxy resin compound modified with benzoguanamine
Author(s) -
Iji Masatoshi,
Kiuchi Yukihiro,
Soyama Makoto
Publication year - 2003
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.386
Subject(s) - biphenylene , epoxy , materials science , phenol , composite material , synthetic resin , glass transition , heat resistance , organic chemistry , polymer , chemistry , phenylene
The flame retardancy and heat resistance of a phenol‐biphenylene‐type epoxy resin compound, which forms a self‐extinguishing network structure, were increased by the inclusion of a benzoguanamine‐modified phenol biphenylene resin. The benzoguanamine‐modified phenol biphenylene resin contains a benzoguanamine unit to release non‐flammable nitrogen substances during ignition and to increase the resin's reactivity toward epoxy resins, and biphenylene units to keep the resin's thermal degradation and water resistance. The addition of the benzoguanamine‐modified phenol biphenylene resin in the epoxy resin compound improved the epoxy resin compound's flame retardancy and heat resistance, and also increased its glass transition temperature while maintaining its water resistance and mechanical properties. Copyright © 2003 John Wiley & Sons, Ltd.