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Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins
Author(s) -
Jeng RuJong,
Lo GengSheng,
Chen ChihPing,
Liu YingLing,
Hsiue GingHo,
Su WenChiung
Publication year - 2003
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.343
Subject(s) - epoxy , thermosetting polymer , materials science , phenylphosphine , thermal stability , curing (chemistry) , composite material , glass transition , limiting oxygen index , flammability , chemical engineering , polymer , organic chemistry , pyrolysis , char , chemistry , phosphine , engineering , catalysis
Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.