Thermal conductivity epoxy resin composites filled with boron nitride | Zendy

Gu Junwei | Zendy; Zhang Qiuyu | Zendy; Dang Jing | Zendy; Xie Chao | Zendy

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Thermal conductivity epoxy resin composites filled with boron nitride

Author(s) -

Gu Junwei,

Zhang Qiuyu,

Dang Jing,

Xie Chao

Publication year - 2012

Publication title -

polymers for advanced technologies

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.61

H-Index - 90

eISSN - 1099-1581

pISSN - 1042-7147

DOI - 10.1002/pat.2063

Subject(s) - materials science , composite material , boron nitride , epoxy , thermal conductivity , silane , dielectric , thermal decomposition , mass fraction , boron , conductivity , surface modification , chemical engineering , organic chemistry , chemistry , optoelectronics , engineering

Boron nitride (BN) micro particles modified by silane coupling agent, γ‐aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052 W/mK, five times higher than that of native EP (0.202 W/mK). The mechanical properties of the composites are optimal with 10 wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright © 2011 John Wiley & Sons, Ltd.

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