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Thermomechanical behaviors and dielectric properties of polyaniline‐doped para ‐toluene sulfonic acid/epoxy resin composites
Author(s) -
Belaabed Belkacem,
Wojkiewicz Jean Luc,
Lamouri Saad,
El Kamchi Noureddine,
Redon Nathalie
Publication year - 2012
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.2029
Subject(s) - materials science , composite material , polyaniline , thermal stability , thermogravimetric analysis , dielectric , epoxy , sulfonic acid , fourier transform infrared spectroscopy , dynamic mechanical analysis , dielectric loss , scanning electron microscope , polymer , chemical engineering , polymer chemistry , optoelectronics , engineering , polymerization
Composites based on conductive organic/inorganic fillers dispersed in insulating matrix have been widely investigated because of their widespread applications such as electromagnetic shielding, electrostatic discharge, and sensors. In this context, novel composite materials based on epoxy resin matrix charged with polyaniline (PANI)‐doped para ‐toluene sulfonic acid were elaborated. Fourier transform infrared spectroscopy, X‐ray diffraction and scanning electron microscopy were used to check the structure and the morphology of the samples. Viscoelastic behavior and thermal stability of the composites were explored by dynamic mechanical thermal analysis and thermogravimetric analysis. It was shown that the PANI particles exhibited a partial crystalline structure and were homogeneously dispersed in epoxy matrix. Consequently, this structure affected the thermal stability and viscoelastic properties of the composites. Furthermore, the dielectric and electrical properties were investigated up to 1 MHz. Measurements of dielectric properties revealed that with loading fillers in matrix, the dielectric parameters increased to high values at low frequency then decreased at values around 40 and 32 of real and imaginary parts, respectively, at 1 MHz with 15% of PANI content. Copyright © 2011 John Wiley & Sons, Ltd.