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Preparation of the thermosensitive metal ion imprinted polymer in supercritical carbon dioxide: application in the selective recognition of copper (II)
Author(s) -
Zhang LiJuan,
Cao LiQin,
Wang XiaoHu,
Wang JiDe
Publication year - 2012
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.2024
Subject(s) - materials science , polymerization , precipitation polymerization , copper , polymer , metal ions in aqueous solution , ethylene glycol dimethacrylate , supercritical carbon dioxide , polymer chemistry , supercritical fluid , radical polymerization , chemical engineering , nuclear chemistry , inorganic chemistry , metal , chemistry , organic chemistry , methacrylic acid , composite material , engineering , metallurgy
The temperature‐sensitive Cu(II) ion imprinted polymer (Cu(II)‐MIIP) materials were prepared via precipitation polymerization methods in supercritical carbon dioxide (scCO 2 ) by using methanol as cosolvent. In the polymerization process, the polymerization mixture consists of copper ion, N ‐isopropylacrylamide (functional monomer), ethylene glycol dimethacrylate (crosslinker), and 2,2′‐azobisisobutyronitrile (initiator). Non‐imprinted polymer particles were similarly prepared in the same way except for the presence of copper ion in the polymerization reaction. In this study, the characteristic of swelling/shrinking for Cu(II)‐MIIP in response to the change in temperature was investigated by scanning electron microscopy and photograph of swelling/shrinking for Cu(II)‐MIIP in deionized water. The above‐synthesized polymer particles were characterized by using Fourier transform infrared, thermo‐gravimetric analysis, and X‐ray diffraction techniques. Furthermore, the complete removal of the copper metal ion from the CuP was confirmed by atomic absorption spectroscopy. The selectivity adsorption of polymer materials was investigated from dilute aqueous solutions, and it was found to have an imprinting efficiency of 2.13 for Zn and Co ions. Copyright © 2011 John Wiley & Sons, Ltd.