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High‐resolution resist for screen printing: application to direct fabrication of Ag circuit
Author(s) -
Okamura Haruyuki,
Kayanoki Minoru,
Takada Kohei,
Nakajiri Hideyuki,
Muramatsu Keiko,
Yamashita Munenori,
Shirai Masamitsu
Publication year - 2012
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.2015
Subject(s) - resist , materials science , methacrylic acid , fabrication , curing (chemistry) , high resolution , photoresist , polymer , resolution (logic) , screen printing , ethylene , polymer chemistry , nanotechnology , optoelectronics , composite material , organic chemistry , copolymer , chemistry , computer science , medicine , catalysis , alternative medicine , remote sensing , layer (electronics) , pathology , geology , artificial intelligence
High‐resolution screen printing was devised. New resist formulation contains a base polymer, which consists of acid‐labile tetrahydropyranyl‐protected carboxylic acid, hydroxyl, and methacrylic functions. As crosslinkers, multifunctional acrylates were employed. Photoacid generators were used for pattern formation. A 10‐µm feature size of resist on a screen plate was obtained on irradiation at 365 nm and followed by development on a stainless steel screen. Post‐exposure curing improved the mechanical characteristics of the resist patterns. A 13‐µm feature size silver circuit was successfully printed on poly(ethylene terephthalate) film without defect. Copyright © 2011 John Wiley & Sons, Ltd.
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