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Residual stress and deformation during rapid cooling process in an epoxy plate
Author(s) -
Hwang Jae Young,
Kim Sung Chul
Publication year - 1994
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.1994.220050506
Subject(s) - materials science , epoxy , composite material , glass transition , residual stress , ultimate tensile strength , relaxation (psychology) , modulus , volume (thermodynamics) , stress (linguistics) , deformation (meteorology) , stress relaxation , creep , polymer , thermodynamics , psychology , social psychology , linguistics , philosophy , physics
Residual stress in the epoxy plate during a rapid cooling process was measured by the layer removal method and calculated by the linear thermoviscoelastic theory considering specific volume relaxation. The relaxations of the tensile modulus and specific volume were measured by an Instron thermomechanical analyzer. When the starting temperature of the cooling process was near the glass transition temperature of the cured epoxy, the residual stress in the epoxy plate was smaller than when the starting temperature was higher than the glass transition temperature. However, the transient stress in the cured epoxy plate was higher when the starting temperature was near the glass transition temperature than when the starting temperature was higher than the glass transition temperature. The quenched epoxy plate was compressed in the direction parallel to the surface and expanded in the thickness direction.