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Improvements in aluminum adhesion and breakdown voltages of polyvinylidene fluoride films following exposure to gas plasmas
Author(s) -
Mammone Robert J.,
Wade William L.,
Binder Michael
Publication year - 1991
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.1991.220020407
Subject(s) - materials science , polyvinylidene fluoride , wetting , adhesion , plasma , dielectric , aluminium , composite material , dielectric barrier discharge , thin film , dielectric strength , fluoride , optoelectronics , nanotechnology , polymer , inorganic chemistry , physics , quantum mechanics , chemistry
Changes in water wettability, improvement in adhesion of vapor deposited aluminum and increases in dielectric breakdown voltage in thin, 12 micron PVDF films were observed following brief exposure of these films to low‐temperature gas plasmas.