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Processable polyisoimide polymer blends for application as thermally stable adhesives for composites and advanced metal alloys
Author(s) -
Boschan R. H.,
Landis A. L.,
Lau K. S. Y.,
Quezada S.,
Tajima Y. A.
Publication year - 1991
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.1991.220020205
Subject(s) - materials science , polyimide , composite material , adhesive , aluminium , polymer , metal , thermal stability , viscosity , chemical engineering , metallurgy , layer (electronics) , engineering
Abstract Polyimides are effective thermally stable bonding agents for substrates including titanium, aluminum alloys, steel alloys, metal matrix composites, and polymer/fiber composites with good tolerance toward elevated temperature and humidity. Problems associated with polyimide adhesives, including high processing temperatures and pressures and high melt viscosity, can be partially or totally alleviated by use of blends of polyisoimides. During thermal processing, the polyisoimides are isomerized to their polyimide modifications.

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