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Synthesis and properties of oxetane‐based polysiloxanes used for cationic UV curing coatings
Author(s) -
Zhan Fu,
Cheng Xie,
Shi Wenfang
Publication year - 2012
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.1939
Subject(s) - oxetane , cationic polymerization , thermogravimetric analysis , materials science , glass transition , hydrosilylation , thermal stability , dynamic mechanical analysis , photopolymer , polymer chemistry , curing (chemistry) , contact angle , differential scanning calorimetry , chemical engineering , composite material , polymerization , organic chemistry , polymer , chemistry , catalysis , physics , engineering , thermodynamics
Abstract The polysiloxanes end‐capped with oxetane group (PSiO‐H and PSiO‐L) were synthesized via hydrosilylation reaction based on α,ω‐dihydrogen‐terminated polydimethylsiloxanes with a higher (0.23%, PDSi‐H) and lower (0.12%, PDSi‐L) hydrogen amount. The molecular structures were characterized by FT‐IR and 1 H NMR spectroscopy. The polysiloxanes were added into a commercial oxetane‐based resin, 3,3′‐(oxydi(methylene)) bis(3‐ethyloxetane) (DOX), as an additive to prepare a series of cationic UV curable formulations. The photo‐DSC results showed that the maximum photopolymerization rate decreased while the oxetane conversion increased with the polysiloxane content increasing. The surface hydrophobic property of cured films was improved having the water contact angles of 97° and 99° compared with 82° of the cured DOX film with only 1 wt% PSiOs, respectively. The dynamic mechanical thermal analysis results showed that both the storage modulus on the rubbery plateau region and the glass transition temperature decreased with increasing PSiO‐H loading. Moreover, the decrease became more obvious as PSiO‐L was added instead of PSiO‐H due to its lower concentration of oxetane group. The thermal stability of cured films was enhanced by the addition of PSiOs from the thermogravimetric analysis. And the DOX/PSiO‐H film possessed higher thermal degradation temperatures than DOX/PSiO‐L film. Copyright © 2011 John Wiley & Sons, Ltd.