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Study of cure kinetics of epoxy/DDS/nanosized (SiO 2 /TiO 2 ) system by dynamic differential scanning calorimetry
Author(s) -
Safarpour M. A.,
Omrani A.,
Afsar S.,
ZareHosseinAbadi D.
Publication year - 2011
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.1571
Subject(s) - differential scanning calorimetry , diglycidyl ether , materials science , epoxy , curing (chemistry) , activation energy , scanning electron microscope , kinetics , chemical engineering , composite material , bisphenol a , polymer chemistry , chemistry , thermodynamics , physics , quantum mechanics , engineering
In this study the curing kinetics of epoxy based on the diglycidyl ether of bisphenol A (DGEBA), 4,4′‐diaminodiphenyl sulfone (DDS) as a hardener, and SiO 2 /TiO 2 (70:30) as a nanofiller was investigated by nonisothermal differential scanning calorimetry (DSC). The effects of different weight contents of SiO 2 /TiO 2 nanoparticles were studied using DSC in Dynamic Mode and the best value of the nanofiller was found to be 5 phr (parts per hundred). Dynamic measurements were used to obtain the total heat of reaction of the epoxy system as well as its activation energy ( E a ) based on the isoconversional methods of Kissinger and Ozawa. The process revealed a dependence of the activation energy on conversion ( α ). The morphology of the cured system was investigated by scanning electron microscopy (SEM). It showed a strong cross‐linking between the resin and hardner and a relatively better dispersion of surface modified filler nanoparticles. Copyright © 2009 John Wiley & Sons, Ltd.
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