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Dynamic mechanical properties of aluminum nitride/cyanate ester composites for high performance electronic packaging
Author(s) -
Ling Wei,
Gu Aijuan,
Liang Guozheng,
Yuan Li,
Liu Jie
Publication year - 2010
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/pat.1436
Subject(s) - cyanate ester , materials science , composite material , dynamic mechanical analysis , nitride , viscoelasticity , dynamic modulus , modulus , cyanate , dissipation , aluminium , polymer , layer (electronics) , polymer chemistry , physics , epoxy , thermodynamics
Viscoelastic ature is one of the key features of polymeric composites. A series of cyanate ester (CE)‐based composites with different aluminum nitride (AlN) contents for high performance electronic packaging, coded as AlN/CE, were developed; the viscoelastic nature of AlN/CE composites was intensively investigated by employing dynamic mechanical analysis (DMA). Results show that the AlN content has a great effect on dynamic mechanical properties of AlN/CE composites. The storage modulus in the glassy region increases linearly with the addition of AlN as well as the increase of AlN content. Meanwhile, all composites also exhibit notably higher loss modulus than cured CE resin due to the appearance of new energy dissipation forms. In addition, the incorporation of AlN has a significant effect on damping factor peak. All reasons leading to these phenomena are analyzed from the view of structure–property relationship. Copyright © 2009 John Wiley & Sons, Ltd.