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Active Damping of Thin Film Shape Memory Alloy Devices
Author(s) -
Ahmadi S.,
Jacob K.,
Wendler F.,
Padhy A.,
Kohl M.
Publication year - 2021
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.202000310
Subject(s) - shape memory alloy , materials science , sma* , damper , shock (circulatory) , thermoelastic damping , coupling (piping) , vibration , crystallite , field (mathematics) , phase transition , mechanism (biology) , structural engineering , mechanics , composite material , computer science , condensed matter physics , acoustics , engineering , physics , metallurgy , thermodynamics , medicine , mathematics , algorithm , thermal , pure mathematics , quantum mechanics
The thermomechanical coupling in shape memory alloys (SMAs) provides an effective mechanism of vibration damping by a cyclic structural phase transition. Here, we present simulations for an active SMA damper device based on a polycrystalline film materials, in which active damping via the one‐way shape memory effect is exploited. We apply an extension of a previously reported superelastic model, that combines transition state kinetics with a phase field approach for the case of shock loading. By this approach, we are able to describe the time‐resolved active damping performance of the device in agreement with experimental results.