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A displacement‐based analytical stress solution for various adhesive joint configurations
Author(s) -
Methfessel Thomas S.,
Becker Wilfried
Publication year - 2021
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.202000020
Subject(s) - adhesive , joint (building) , displacement (psychology) , materials science , structural engineering , stress (linguistics) , shear (geology) , work (physics) , linear elasticity , shear stress , layer (electronics) , composite material , finite element method , engineering , mechanical engineering , psychology , linguistics , philosophy , psychotherapist
The present work provides a simple and precise thermo‐mechanical model for the prediction of stress distributions in adhesive joints. A displacement‐based derivation is applied, using a general sandwich‐type model for the overlap region. For the adhesive layer a linear displacement approach is proposed, which captures the variation of the shear stresses in the through‐thickness direction. The model covers various joint configurations with linear‐elastic material behavior under different load cases.