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Fatigue Reliability Analysis and Design for Structural Components in Quasi‐One‐Shot Device
Author(s) -
Wang Haiqiao,
Chen Min,
Yao Xiaofei,
Liu Zhiyuan,
Wang Xiang,
Tate Derrick
Publication year - 2018
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201800410
Subject(s) - reliability (semiconductor) , reliability engineering , component (thermodynamics) , interference (communication) , computer science , circuit breaker , stress (linguistics) , one shot , shot (pellet) , electronic engineering , engineering , mechanical engineering , materials science , telecommunications , physics , power (physics) , channel (broadcasting) , linguistics , philosophy , quantum mechanics , metallurgy , thermodynamics
The reliability of the quasi‐one‐shot device is a crucial index and hard to predict due to its complexity and cost‐consuming of testing. In this paper, a bi‐directional approach of reliability optimization design (ROD), integrating stress‐strength interference model and fatigue analysis, was proposed to evaluate and optimize the weakest component of the quasi‐one‐shot device. High‐voltage vacuum circuit breaker was used as a numerical validation example.