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A general modelling framework and specific mechanical approaches to simulate curing phenomena in polymers
Author(s) -
Landgraf Ralf,
Ihlemann Jörn
Publication year - 2016
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201610172
Subject(s) - curing (chemistry) , viscoelasticity , materials science , polymer , adhesive , viscoplasticity , thermal , polymerization , polymer science , composite material , thermodynamics , constitutive equation , physics , finite element method , layer (electronics)
Polymers are employed as adhesives, filling or sealing materials, among others. Within these applications, a chemical reaction (e.g. polymerization) leads the materials to cure from a liquid to a solid. In this contribution, first a general continuum mechanical modelling framework for the simulation of curing phenomena is highlighted. It takes into account the main chemical, thermal and mechanical phenomena of polymeric curing processes. Secondly, different mechanical models to capture the mechanical behaviour of polymeric curing processes are regarded. It is shown that elastic, viscoelastic and viscoplastic models at large deformations can be employed. (© 2016 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)