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FE‐simulation of spatially graded gelation during adhesive's curing
Author(s) -
Rudolph Martin,
Landgraf Ralf,
Ihlemann Jörn
Publication year - 2015
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201510166
Subject(s) - curing (chemistry) , adhesive , exothermic reaction , materials science , composite material , mechanical engineering , computer science , engineering , thermodynamics , physics , layer (electronics)
In this contribution main aspects of material characterization and modelling of a curing adhesive are denoted. It is pointed out how to deal with the exothermic heat generation during curing, both, how to obtain it experimentally as well as how to account for it in the continuum mechanical an FE‐modelling framework. Furthermore, a strategy to simulate spatially graded gelation processes in ANSYS® is presented. An academic simulation example completes this work. By the help of this simulation tool a better understanding of a novel manufacturing process of smart semi‐finished light weight structures is ensured. (© 2015 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)