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Modeling the moisture and temperature dependent material behavior of adhesive bonds
Author(s) -
Goldschmidt Florian,
Diebels Stefan
Publication year - 2015
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201510138
Subject(s) - adhesive , materials science , viscoelasticity , moisture , composite material , polymer , polyurethane , compressibility , work (physics) , layer (electronics) , thermodynamics , physics
Although bonding has been known for a long time, the mechanical behavior of adhesive bonded joints comes more and more into the focus of scientific attention. During usage, adhesives are exposed to environmental influences like temperature, moisture and radiation. Due to the fact that adhesives usually consist of polymers, these influences change their mechanical behavior. In the presented work, a viscoelastic cross‐linked polyurethane that behaves incompressible is investigated. A three‐dimensional mechanical model is presented, which takes into consideration influences of changes in temperature as well as in the moisture concentration inside the adhesive layer and its thickness on the mechanical behavior. (© 2015 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)