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Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces
Author(s) -
Sbeiti Mohamad,
Müller Wolfgang H.,
SchneiderRamelow Martin,
Geissler Ute,
Schmitz Stefan
Publication year - 2012
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201210173
Subject(s) - intermetallic , materials science , ultrasonic sensor , diffusion , diffusion bonding , phase (matter) , wire bonding , jump , microelectromechanical systems , thermal , composite material , atomic diffusion , thermodynamics , nanotechnology , chemistry , chip , electrical engineering , acoustics , physics , engineering , organic chemistry , alloy , quantum mechanics
Ultrasonic wire bonding is a method applied in electronic packaging to fabricate interconnections between two devices at ambient temperature. In order to investigate the material diffusion during this process, the occurring thermal and mechanical mechanisms at and around the interface of the formed bond were studied by means of coupled thermo‐mechanical FE simulations. Within the framework of material forces the local jump of the Eshelby tensor was compared with the thickness of the formed intermetallic phase for various bonding parameters. This allows us to predict an effective diffusion constant which takes temperature and mechanical driving forces into account. After this relation has been established a subsequent objective of our investigations is to optimize the growth of the Au8Al3 intermetallic phase in terms of bonding parameters. (© 2012 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)