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Micromechanical creep model for pure copper
Author(s) -
OzhogaMaslovskaja Oksana,
Altenbach Holm,
Naumenko Konstantin,
Prygorniev Oleksandr,
Vodka Oleksii
Publication year - 2011
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201110201
Subject(s) - creep , micromechanics , materials science , copper , anisotropy , voronoi diagram , stress (linguistics) , mechanics , microstructure , composite material , geometry , metallurgy , physics , mathematics , optics , linguistics , philosophy , composite number
A Unit Cell made of copper is simulated and investigated under creep conditions within the framework of micromechanics. Geometrical 3D model of the copper microstructure is represented as a Unit Cell with grains of random crystallographical orientation and geometry. Such simulation enables algorithm of Voronoi tessellation. The stress‐strain behavior of grains in the general case is anisotropic due to the ordered crystalline structure. The anisotropic model for a material with a cubic symmetry is implemented in Abaqus and used to assign behavior of grain interior in elastic and creep regions. Material parameters for elastic model are taken from elastic tests of single crystal copper [1]. Power law material parameters for creep model are taken from creep test performed for single crystal copper [2]. The model parameter ξ is validated numerically. Creep results are presented for the case of proportional loading during the primary and secondary creep. Statistical analysis of creep curves received for 55 different realizations of Unit Cell geometry is carried out. As a result confident interval and mathematical expectation of creep data are calculated. (© 2011 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)