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A one‐dimensional approach to the chemical and thermo‐mechanical coupled modeling of curing adhesives including plasticity
Author(s) -
Liebl Christoph,
Lion Alexander
Publication year - 2011
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201110194
Subject(s) - viscoelasticity , plasticity , curing (chemistry) , shrinkage , materials science , hardening (computing) , isotropy , adhesive , composite material , physics , layer (electronics) , quantum mechanics
The modeling and simulation of curing adhesives is of great importance for industrial applications, mainly for the automotive industry. The one‐dimensional model proposed here combines known viscoelastic models for curing material with effects of plasticity. To describe these plasticity effects, a yield stress with isotropic hardening is formulated as an equation of temperature and degree of cure. The proposed model therefore includes viscoelastic properties, thermo‐chemical shrinkage and the aforementioned plasticity characteristics, all as functions of temperature and degree of cure. (© 2011 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)