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Towards the simulation of grinding processes – a thermoplastic single grain approach
Author(s) -
Holtermann Raphael,
Menzel Andreas,
Hortig Christian,
Svendsen Bob
Publication year - 2011
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201110184
Subject(s) - thermoelastic damping , materials science , thermoplastic , grinding , viscoplasticity , softening , work (physics) , displacement (psychology) , thermal , position (finance) , deformation (meteorology) , constitutive equation , mechanical engineering , mechanics , structural engineering , composite material , finite element method , engineering , thermodynamics , physics , psychology , finance , economics , psychotherapist
The current work aims at the modelling and simulation of metal grinding processes with focus on the thermal behaviour resulting from the interaction of tool and workpiece. Starting from a two‐dimensional model of a single grain, representative numerical experiments are carried out based on the variation of grain geometry and its spatial position relative to the workpiece to predict the resulting load‐displacement‐behaviour. Here, a thermoelastic viscoplastic constitutive model is used to capture thermal softening of the material taken into account. Referring to previous research, an adaptive remeshing scheme, based on a combination of error estimation and refinement indication is used to overcome mesh dependence, allowing to resolve the complex deformation patterns and to predict a realistic thermomechanical state of the resulting workpiece surface. (© 2011 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)