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Multiscale Modeling for the Simulation of Damage Processes at Refractory Materials under Thermal Shock
Author(s) -
Henneberg Dimitri,
Ricoeur Andreas
Publication year - 2011
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201110067
Subject(s) - coalescence (physics) , materials science , microstructure , thermal shock , ceramic , damage mechanics , fracture mechanics , continuum mechanics , composite material , mechanics , finite element method , thermodynamics , physics , astrobiology
Refractory materials, for example ceramic materials, initially contain a multitude of defects such as voids, microcracks, grain boundaries etc. The deformation process and failure mechanisms due to thermal shock at high temperatures above 1000°C are going along with the creation of new micro defects as well as the growth and coalescence of cracks. A material damage model based on the theoretical concept of damage mechanics and the mechanics of microcracks is presented in this paper. Cell models are developed as representative volume elements (RVE) including crack initiation and growth as well as microstructural shielding effects. For simple configurations of the microstructure, the relation between stress, strain and temperature is derived from analytical considerations. (© 2011 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)