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Fracture and Fragmentation of Silicon Dies
Author(s) -
Laun Christoph,
Pandolfi Anna,
Ghisi Aldo,
Weinberg Kerstin
Publication year - 2010
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.201010054
Subject(s) - silicon , fragmentation (computing) , materials science , fracture (geology) , engineering physics , composite material , structural engineering , computer science , engineering , optoelectronics , operating system
Different failure modes of silicon are observed. Experimental results are not able to explain these variations clearly and therefore numerical simulations have been performed. In order to reduce high computational costs a simplified method to introduce weakened areas on silicon chips is presented. (© 2010 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)