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Thermo‐mechanical behaviour of X‐ray masks in micro system technology
Author(s) -
Körner Claudia,
Seemann Wolfgang
Publication year - 2009
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.200910159
Subject(s) - liga , resist , lithography , synchrotron radiation , mechanical engineering , fabrication , microelectromechanical systems , process (computing) , deformation (meteorology) , materials science , optics , engineering physics , nanotechnology , computer science , optoelectronics , physics , engineering , composite material , medicine , alternative medicine , pathology , layer (electronics) , operating system
In the field of micro system technology, the fabrication of micro structure components is on the cusp to industrial production due to economical competition and the necessity to innovate technology. Regarding the X‐Ray lithography process (LIGA), an X‐Ray radiation passes through a mask in form of a membrane with extremely high intensive synchrotron radiation. This leads to locally high temperatures and thus to an inhomogeneous and unsteady deformation in the mask and in the resist. Though, necessary for the production process, this concentration of energy is contradictory to the demand of quality. The goal of this paper is to present a first simplified model of the exposure step in a finite‐element program in order to get a tool providing an optimization of the temperature rise. (© 2009 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)