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Numerical analysis of micromachining of C45 steel by single abrasive grain
Author(s) -
Chodor Jaroslaw,
Kukielka Leon
Publication year - 2008
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.200810715
Subject(s) - abrasive , machining , finite element method , grinding , mechanical engineering , materials science , process (computing) , contact area , computation , stress (linguistics) , chip formation , boundary value problem , contact mechanics , computer science , structural engineering , tool wear , engineering , mathematics , algorithm , composite material , mathematical analysis , linguistics , philosophy , operating system
Grinding is a very complicated processing. To increase quality of product and minimize the cost of abrasive machining, we should know physical phenomena which exist during the process. The first step to solution of this problem is analysis of machining process with a single abrasive grain. In the paper [1] the thermo–mechanical models of this process are presented, but in this work attention is concentrated on chip formation and his separation from object for different velocity of abrasive grain. The phenomena on a typical step time were described using step–by–step incremental procedure, with updated Lagrangian formulation. Then, the finite elements methods (FEM) and dynamic explicit method (DEM) were used to obtain the solution. Application was developed in the ANSYS system, which makes possible a complex time analysis of the physical phenomena – states of: displacements, strains and stress. Numerical computations of the strain have been conducted with the use of two methodologies. The first one requires an introduction of boundary conditions for displacements in the contact area determined in modeling investigation, while the second – a proper definition of the contact zone, without the necessity to introduce boundary conditions in the contact area. Examples of calculations for the intensity of stress in the surface layer zones were presented. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)