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Modeling Phase Separation and Coarsening in Ag‐Cu
Author(s) -
Müller Wolfgang H.,
Böhme Thomas
Publication year - 2006
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.200610182
Subject(s) - spinodal decomposition , microelectronics , intermetallic , nucleation , soldering , materials science , diffusion , alloy , miniaturization , phase (matter) , microstructure , spinodal , metallurgy , thermodynamics , nanotechnology , chemistry , physics , organic chemistry
The ongoing miniaturization and environmental trends in microelectronics recently turn the attention to new materials the properties of which still have to be studied. Of fundamental importance for material properties is the temporal development of the microstructure which can experimentally be observed in several solder alloys. Starting with a detailed overview on coarsening phenomena and intermetallic growth as observed in lead‐free solders we concentrate on the description of nucleation and spinodal decomposition in these alloys. An extended diffusion equation of the phase field type is presented in which all required material parameters are determined either from the literature / databases or from calculations based on the Embedded‐Atom Method (EAM). We will restrict to the one dimensional case of diffusion and consider as an example the FCC‐structured lead‐free binary solder alloy Ag‐Cu. Furthermore a numerical study is performed in order to arrive at a quantitative description of temporal micromorphological development. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)