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Numerical Simulation of Thermal Effects in Electric Circuits via Energy Transport equations
Author(s) -
Brunk Markus
Publication year - 2006
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.200610013
Subject(s) - modified nodal analysis , electronic circuit , diode , finite element method , semiconductor device , work (physics) , exponential function , mechanics , coupling (piping) , convection–diffusion equation , physics , mathematics , mathematical analysis , materials science , engineering , thermodynamics , mechanical engineering , quantum mechanics , medicine , layer (electronics) , nodal , composite material , anatomy
In this work we present the coupling of stationary energy‐transport (ET) equations with Modified Nodal Analysis (MNA)‐equations to model electric circuits containing semiconductor devices. The one‐dimensional ET‐equations are discretised in space by an exponential fitting mixed hybrid finite element approach to ensure current continuity and positivity of charge carriers. The discretised ET‐equations are coupled to MNA‐equations and the resulting system is solved with backwarddifference formulas. Numerical examples are shown for a test circuit containing a pn‐diode, and the results are compared to those achieved using the drift‐diffusion model to describe the semiconductor devices in the circuit. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)