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A Finite Interface Crack Interacting With A Subinterface Crack In Metal/Piezoelectric Ceramic Bimaterial
Author(s) -
Tian WenYe,
Gabbert Ulrich
Publication year - 2003
Publication title -
pamm
Language(s) - English
Resource type - Journals
ISSN - 1617-7061
DOI - 10.1002/pamm.200310390
Subject(s) - piezoelectricity , materials science , crack tip opening displacement , electric displacement field , displacement (psychology) , stress intensity factor , traction (geology) , crack closure , structural engineering , crack growth resistance curve , fracture mechanics , mechanics , composite material , physics , engineering , mechanical engineering , psychology , psychotherapist
The “pseudo‐traction‐electric‐displacement’ method was adopted to solve the interaction problem between a finite interface crack and a subinterface crack in metal/piezoelectric bimaterial. After deriving the fundamental solutions for a finite interface crack and a special subinterface crack respectively loaded by the normal and tangential concentrated tractions and the concentrated electric displacement, the present interaction problem was reduced to a system of integral equations, which may be solved numerically. The crack tip mode I stress intensity factor was calculated and detailed comparisons of the results derived under the compound mechanical‐electric loading conditions and those derived under the purely mechanical loading condition are performed.