A Finite Interface Crack Interacting With A Subinterface Crack In Metal/Piezoelectric Ceramic Bimaterial

The “pseudo‐traction‐electric‐displacement’ method was adopted to solve the interaction problem between a finite interface crack and a subinterface crack in metal/piezoelectric bimaterial. After deriving the fundamental solutions for a finite interface crack and a special subinterface crack respectively loaded by the normal and tangential concentrated tractions and the concentrated electric displacement, the present interaction problem was reduced to a system of integral equations, which may be solved numerically. The crack tip mode I stress intensity factor was calculated and detailed comparisons of the results derived under the compound mechanical‐electric loading conditions and those derived under the purely mechanical loading condition are performed.