Open AccessFirst CCD‐in‐CMOS‐Based Multispectral TDI Image Sensor
Author(s) -
Borremans Jonathan,
De Moor Piet
Publication year - 2017
Publication title -
optik & photonik
Language(s) - English
Resource type - Journals
eISSN - 2191-1975
pISSN - 1863-1460
DOI - 10.1002/opph.201700021
Subject(s) - multispectral image , cmos , image sensor , charge coupled device , pixel , computer science , chip , sensitivity (control systems) , cmos sensor , time delay and integration , computer hardware , artificial intelligence , computer vision , electronic engineering , optics , engineering , physics , telecommunications
A new approach to charge‐coupled device (CCD)‐based time‐delay‐and‐integration (TDI) imaging is presented that implements the CCD TDI pixels together with advanced CMOS drivers and readout in one single chip. This CCD‐in‐CMOS technology is compatible with backside illumination for enhanced sensitivity, and multispectral filters can be added for increased imaging performance. With this highly sensitive and high‐speed imaging solution, high‐end applications such as remote sensing, life sciences and machine vision are targeted.