Open AccessCover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018)
Author(s) -
Knapp Caroline E.,
Metcalf Elizabeth A.,
Mrig Shreya,
SanchezPerez Clara,
Douglas Samuel. P.,
Choquet Patrick,
Boscher Nicolas D.
Publication year - 2018
Publication title -
chemistryopen
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 29
ISSN - 2191-1363
DOI - 10.1002/open.201800200
Subject(s) - copper , monomer , electrical conductor , sintering , materials science , chemical engineering , diamine , cover (algebra) , inkwell , inkjet printing , nanotechnology , polymer chemistry , chemistry , metallurgy , composite material , polymer , mechanical engineering , engineering
The Cover Feature shows bidentate diamine and amino‐alcohol ligands, which are used to form solid, water‐soluble, and air‐stable monomeric copper complexes for low‐temperature plasma‐assisted inkjet printing of conductive copper. More information can be found in the Full Paper by C. E. Knapp et al. on page 850 in Issue 11, 2018 (DOI: 10.1002/open.201800131).