Open AccessPrecursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper
Author(s) -
Knapp Caroline E.,
Metcalf Elizabeth A.,
Mrig Shreya,
SanchezPerez Clara,
Douglas Samuel. P.,
Choquet Patrick,
Boscher Nicolas D.
Publication year - 2018
Publication title -
chemistryopen
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 29
ISSN - 2191-1363
DOI - 10.1002/open.201800131
Subject(s) - copper , monomer , sintering , atmospheric pressure , chemistry , thermal decomposition , denticity , yield (engineering) , infrared spectroscopy , thermogravimetric analysis , analytical chemistry (journal) , decomposition , gravimetric analysis , mass spectrometry , crystal structure , nuclear chemistry , crystallography , materials science , organic chemistry , polymer , metallurgy , chromatography , oceanography , geology
Bidentate diamine and amino‐alcohol ligands have been used to form solid, water‐soluble, and air‐stable monomeric copper complexes of the type [Cu(NH 2 CH 2 CH(R)Y) 2 (NO 3 ) 2 ] ( 1 , R=H, Y=NH 2 ; 2 , R=H, Y=OH; 3 , R=Me, Y=OH). The complexes were characterized by elemental analysis, mass spectrometry, infrared spectroscopy, thermal gravimetric analysis, and single‐crystal X‐ray diffraction. Irrespective of their decomposition temperature, precursors 1 – 3 yield highly conductive copper features [1.5×10 −6 Ω m (±5×10 −7 Ω m)] upon atmospheric‐pressure plasma‐enhanced sintering.