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Failure analysis of solder joints with a damage‐coupled viscoplastic model
Author(s) -
Wei Y.,
Chow C. L.,
Neilsen M. K.,
Fang H. E.
Publication year - 2003
Publication title -
international journal for numerical methods in engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.421
H-Index - 168
eISSN - 1097-0207
pISSN - 0029-5981
DOI - 10.1002/nme.660
Subject(s) - viscoplasticity , soldering , finite element method , subroutine , creep , constitutive equation , structural engineering , materials science , dependency (uml) , plasticity , mechanical engineering , computer science , engineering , metallurgy , composite material , operating system , software engineering
This paper presents failure analysis of solder joints with a damage‐coupled viscoplastic model. A material model is developed to characterize the elasticity, plasticity, creep and damage of solder. A semi‐implicit time‐integration approach is adopted for the numerical implementation of the solder model. This solder model has been implemented into finite element codes developed at Sandia National Laboratories and into the commercial, finite element code ABAQUS TM with its user‐defined material subroutine UMAT. Finite element analyses are performed on solder joints with the new solder constitutive model and mesh dependency of these analyses is investigated. Copyright © 2003 John Wiley & Sons, Ltd.