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Stress‐based multi‐material topology optimization of compliant mechanisms
Author(s) -
Chu Sheng,
Gao Liang,
Xiao Mi,
Luo Zhen,
Li Hao
Publication year - 2017
Publication title -
international journal for numerical methods in engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.421
H-Index - 168
eISSN - 1097-0207
pISSN - 0029-5981
DOI - 10.1002/nme.5697
Subject(s) - topology optimization , compliant mechanism , topology (electrical circuits) , level set method , interpolation (computer graphics) , stress (linguistics) , mathematical optimization , displacement (psychology) , set (abstract data type) , sensitivity (control systems) , parametric statistics , hinge , level set (data structures) , optimization problem , computer science , finite element method , structural engineering , mathematics , engineering , motion (physics) , psychology , linguistics , philosophy , statistics , combinatorics , segmentation , artificial intelligence , electronic engineering , image segmentation , psychotherapist , programming language
In this paper, a level‐set‐based method is presented to deal with the multi‐material topology optimization of compliant mechanisms with stress constraints. A novel stress‐based multi‐material topology optimization model of compliant mechanisms is proposed. In this model, the multi‐material level set topology description model and the separable stress interpolation scheme are adopted. The weighted sum method is used to deal with the multi‐objective optimization of the output displacement and compliance of compliant mechanisms. The penalty of stresses is also considered in the objective function to control the local stress level in different materials. To solve the optimization problem, the parametric level set method is employed, and the sensitivity analysis is conducted. Application of the method is demonstrated by 2 numerical examples. Results show that the multi‐material structures without undesirable de facto hinges can be obtained. The output displacement and compliance of the compliant mechanisms are optimized, and stress constraints in different materials are simultaneously satisfied.