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Robust C 0 high‐order plate finite element for thin to very thick structures: mechanical and thermo‐mechanical analysis
Author(s) -
Polit O.,
Vidal P.,
D'Ottavio M.
Publication year - 2012
Publication title -
international journal for numerical methods in engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.421
H-Index - 168
eISSN - 1097-0207
pISSN - 0029-5981
DOI - 10.1002/nme.3328
Subject(s) - quadrilateral , finite element method , plate theory , spurious relationship , structural engineering , bending of plates , distortion (music) , stress (linguistics) , kinematics , geometry , mathematical analysis , materials science , mathematics , physics , engineering , classical mechanics , bending , amplifier , linguistics , statistics , philosophy , optoelectronics , cmos
SUMMARY This paper presents a new C 0 eight‐node quadrilateral finite element (FE) for geometrically linear elastic plates. This finite element aims at modeling both thin and thick plates without any pathologies of the classical plate finite elements (shear and Poisson or thickness locking, spurious modes, etc). A C 1 FE was previously developed by the first author based on the kinematics proposed by Touratier. This new FE can be viewed as an evolution towards three directions: (1) use of only C 0 FE approximations; (2) modeling of thick to thin structures; and (3) capability in multifield problems. The transverse normal stress is included allowing use of the three‐dimensional constitutive law. The element performances are evaluated on some standard plate tests, and comparisons are given with exact three‐dimensional solutions for plates under mechanical and thermal loads. Comparisons are made with other plate models using C 1 and semi‐C 1 FE approximations as well as with an eight node C 0 FE based on the Reissner–Mindlin model. All results indicate that the present element is highly insensitive to mesh distortion, has very fast convergence properties and gives accurate results for displacements and stresses. Copyright © 2012 John Wiley & Sons, Ltd.