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Coupled multi‐scale cohesive modeling of failure in heterogeneous adhesives
Author(s) -
Kulkarni M. G.,
Matouš K.,
Geubelle P. H.
Publication year - 2010
Publication title -
international journal for numerical methods in engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.421
H-Index - 168
eISSN - 1097-0207
pISSN - 0029-5981
DOI - 10.1002/nme.2923
Subject(s) - finite element method , isotropy , scale (ratio) , mathematics , computer science , equivalence (formal languages) , failure mode and effects analysis , convergence (economics) , rate of convergence , macro , algorithm , mathematical optimization , structural engineering , engineering , physics , economics , computer network , channel (broadcasting) , discrete mathematics , quantum mechanics , economic growth , programming language
A multi‐scale cohesive numerical framework is proposed to simulate the failure of heterogeneous adhesively bonded systems. This multi‐scale scheme is based on Hill's variational principle of energy equivalence between the higher and lower level scales. It provides an easy way to obtain accurate homogenized macroscopic properties while capturing the physics of failure processes at the micro‐scale in sufficient detail. We use an isotropic rate‐dependent damage model to mimic the failure response of the constituents of heterogeneous adhesives. The finite element method is used to solve the equilibrium equation at each scale. A nested iterative scheme inspired by the return mapping algorithm used in computational inelasticity is implemented. We propose a computationally attractive technique to couple the macro‐ and micro‐scales for rate‐dependent constitutive laws. We introduce an adhesive patch test to study the numerical performance, including spatial and temporal convergence of the multi‐scale scheme. We compare the solution of the multi‐scale cohesive scheme with a direct numerical simulation. Finally, we solve mode I and mode II fracture problems to demonstrate failure at the macro‐scale. Copyright © 2010 John Wiley & Sons, Ltd.