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Thermal contact conductance characterization via computational contact homogenization: A finite deformation theory framework
Author(s) -
Temizer İ.,
Wriggers P.
Publication year - 2010
Publication title -
international journal for numerical methods in engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.421
H-Index - 168
eISSN - 1097-0207
pISSN - 0029-5981
DOI - 10.1002/nme.2822
Subject(s) - homogenization (climate) , thermal contact conductance , boundary value problem , dissipation , materials science , mechanics , thermal , jump , contact area , heat flux , heat transfer , composite material , thermodynamics , mathematics , thermal resistance , physics , mathematical analysis , quantum mechanics , biology , biodiversity , ecology
In order to predict the macroscopic thermal response of contact interfaces between rough surface topographies, a computational contact homogenization technique is developed at the finite deformation regime. The overall homogenization framework transfers macroscopic contact variables, such as surfacial stretch, pressure and heat flux, as boundary conditions on a test sample within a micromechanical interface testing procedure. An analysis of the thermal dissipation within the test sample reveals a thermodynamically consistent identification for the macroscopic thermal contact conductance parameter that enables the solution of a homogenized thermomechanical contact boundary value problem based on standard computational approaches. The homogenized contact response effectively predicts a temperature jump across the macroscale contact interface. The strong dependence of this homogenized response on macroscale solution variables of interest is demonstrated via representative three‐dimensional numerical investigations. The proposed contact homogenization framework is suitable for the analysis of similar energy transport phenomena across heterogeneous contact interfaces where the investigation of the sources for energy dissipation is of concern. Copyright © 2010 John Wiley & Sons, Ltd.