Open AccessHybrid structural electronics printing by novel dry film stereolithography and laser induced forward transfer
Author(s) -
Levy Asaf,
Bernstein Toker Gil,
Winter Shoshana,
Cohen Sharona S.,
Ermak Oleg,
Peled Itay,
Kotler Zvi,
Gelbstein Yaniv
Publication year - 2021
Publication title -
nano select
Language(s) - English
Resource type - Journals
ISSN - 2688-4011
DOI - 10.1002/nano.202000269
Subject(s) - stereolithography , transfer printing , materials science , electronics , 3d printing , interconnection , electrical conductor , resistive touchscreen , laser , stack (abstract data type) , mechanical engineering , nanotechnology , computer science , composite material , electrical engineering , optics , engineering , computer vision , programming language , computer network , physics
3D printing has seen much progress in recent decades with the introduction of new materials and printing techniques. This article describes the combination of a novel, stereolithography (SLA) based method for structural material buildup with laser induced forward transfer (LIFT) printing of conductive and resistive elements and placement of commercial active and passive components for the additive manufacturing of 3D functional electronic devices. The structural material is composed of dry film photoresists that are exposed and laminated to form a stack which is later developed to remove unexposed area and reveal the desired free form shape. Interconnection using pillar penetration between the structural layers is described in detail. Several examples of functional objects (lamp, microphone) demonstrate the practicality of this novel, multi material printing method.