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Modelling strain localization in granular materials using micropolar theory: numerical implementation and verification
Author(s) -
Alshibli Khalid A.,
Alsaleh Mustafa I.,
Voyiadjis George Z.
Publication year - 2006
Publication title -
international journal for numerical and analytical methods in geomechanics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.419
H-Index - 91
eISSN - 1096-9853
pISSN - 0363-9061
DOI - 10.1002/nag.534
Subject(s) - overburden pressure , granular material , shear band , materials science , mechanics , finite element method , plane stress , boundary value problem , particle (ecology) , constitutive equation , shear (geology) , computer simulation , shear stress , stress (linguistics) , composite material , geotechnical engineering , mathematics , physics , structural engineering , mathematical analysis , geology , engineering , linguistics , oceanography , philosophy
Abstract Implementation and applications for a constitutive numerical model on F‐75 silica sand, course silica sand and two sizes of glass beads compressed under plane strain conditions are presented in this work. The numerical model is used to predict the stress versus axial strain and volumetric strain versus axial strain relationships of those materials; moreover, comparisons between measured and predicted shear band thickness and inclination angles are discussed and the numerical results compare well with the experimental measurements. The numerical model is found to respond to the changes in confining pressure and the initial relative density of a given granular material. The mean particle size is used as an internal length scale. Increasing the confining pressure and the initial density is found to decrease the shear band thickness and increase the inclination angle. The micropolar or Cosserat theory is found to be effective in capturing strain localization in granular materials. The finite element formulations and the solution method for the boundary value problem in the updated Lagrangian frame (UP) are discussed in the companion paper. Copyright © 2006 John Wiley & Sons, Ltd.